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    PCB Design

    • 1. Capability & Strength
    • 1. Comprehensive tester library and extensive experience in major test systems.
    • 2. Impedance Controlled Product
    • 3. High Speed - USB(2.0 / 3.0), MIPI, SATA
    • 4. Design Guideline through previous simulations
    • 2. Design Service
    • 1. Probe Card (Cantilerver, Flipchip, WLCSP, VPC)
    • 2. PIB, Loadboard, Direct Dock
    • 3. Low Leakage Current PCB
    • 4. Motherboards for PRVX

    PCB Design Capabilities

    - Optimized PCB Design of Tester (ATE) for multi-layer production.

    - As per customer’s request, Capabilities for PCB design and manufacturing including Digital, Analog, Mixed signal.

    SOC (AP)

    U-Flex (SD, XD, PLUS), T2000, V93K(DD) and etc.

    Display Drive IC

    T6371, T6372, T6373, T6391
    TS7600, ST6730(A), Diamond X

    MEMORY

    T5830, T5377, T5833,
    MT6121, DF8600, FOS8000,
    V5400, K8000, Magnum5 (XV, SSV)

    CIS
    (Cmos Image Sensor)

    IP750, IP750EX,
    Magnum, T2000

    PMIC
    (Power Management IC)

    ETS-600, T2000, U-Flex

    Load Board

    V93K, T2000,
    U-Flex, ETS364

    PCB Manufacturing Capabilities

    ITEM SPEC
    Layer ~140 Layers
    Min, Pitch 0.27 Pitch(Under 2T), 0.35 Pitch(Under 4.8T)
    Option BVH, HPL, Back-Drill, Build Up, BUMP
    Imp Control ±10% (DC resistor not included ±5%)
    Finishes ENIG, ELECTROLYTIC GOLD(Hard Gold)

    PCB Design for High speed signal processing

    - Low DF (Dissipation Factor) material & Impedance matching (50, 90, 100Ω) design.

    - Providing Simulation Data (SI/PI Software and engineer)

    PCB Design
    (Allegro)

    Modeling
    (Power SI)

    Simulation
    (Power SI)

    PCB
    Sample Manufacturing

    VNA measurement
    (Anritsu MS46322A)

    Consequences
    & analysis

    Delivery Management Process

    - PCB designed by SDA, After manufacturing process, Quality inspection be conducted as well.

    - In case Defective has been found during quality inspection, Repair & Modify service is provided by our C/S team.

    1st   Inspection
    • AOI Inspection

      (Automatic Optical Inspection)

    • BBT Test

      (Bare Board Test)

    • 1st Manual

      (1st Manual Inspection)

    2nd   Inspection
    • 2nd Manual Inspection

    • Component Test
    • Designer Confirm & Final Inspection
    • Delivery
    * 2nd Inspection is counducted by SDA